1. 2. 3. material content data sheet sales product name bsc030n03ms g issued 19. february 2015 ma# MA001336450 package pg-tdson-8-1 weight* 120.48 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 1.840 1.53 1.53 15273 15273 leadframe non noble metal iron 7439-89-6 0.038 0.03 314 inorganic material phosphorus 7723-14-0 0.011 0.01 94 non noble metal copper 7440-50-8 37.762 31.34 31.38 313420 313828 wire non noble metal copper 7440-50-8 0.045 0.04 0.04 370 370 encapsulation organic material carbon black 1333-86-4 0.085 0.07 703 plastics epoxy resin - 6.010 4.99 49886 inorganic material silicondioxide 60676-86-0 36.232 30.07 35.13 300723 351312 leadfinish non noble metal tin 7440-31-5 1.452 1.20 1.20 12049 12049 plating noble metal silver 7440-22-4 0.166 0.14 0.14 1374 1374 solder noble metal silver 7440-22-4 0.047 0.04 394 non noble metal tin 7440-31-5 0.038 0.03 315 non noble metal lead 7439-92-1 1.813 1.50 1.57 15045 15754 heatspreader non noble metal iron 7439-89-6 0.011 0.01 94 inorganic material phosphorus 7723-14-0 0.003 0.00 28 non noble metal copper 7440-50-8 11.320 9.40 9.41 93956 94078 heat sink clip non noble metal iron 7439-89-6 0.022 0.02 185 inorganic material phosphorus 7723-14-0 0.007 0.01 56 noble metal silver 7440-22-4 1.289 1.07 10702 non noble metal copper 7440-50-8 22.292 18.50 19.60 185019 195962 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and contains pb according rohs exemption 7a, lead in high melting temperature type solders. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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